Data Sheet

XY-MBA32A Bluetooth

Module

Data

sheet

www.newbitsiot.com

9 Cautions

9.1 Reflow Soldering

Reflow soldering is a vitally important step in the SMT process. The temperature curve associated

with the reflow is an essential parameter to control to ensure the correct connection of parts. The

parameters of certain components will also directly impact the temperature curve selected for this

step in the process.

9.2 Temperature-Time Profile for Reflow Soldering:

i. The standard reflow profile has four zones: ①preheat, ②soak, ③reflow, and

④cooling. The profile describes the ideal temperature curve of the top layer of the

PCB.

ii. During reflow, modules should not be above 260°C and not for more than 30 seconds.