Data Sheet

AMD Confidential—Advance Information
AMD RZ608™ Data Sheet
56932 Rev. 0.50 August 2020
14
Thermal Specification
Chapter 2
Chapter 2 Thermal Specification
The following table describes the thermal solution design of the AMD RZ608:
Table 5. Thermal Description
Item
Description
Thermal shield performance target
• Full performance at shield temperatures up to 90°C.
• (Functional operation is shield temperatures up to 95°C).
• For thermal chamber testing condition are listed below:
- High Temperature Limit :
If measured as ambient temperatures in thermal chamber,
it should be Chamber_Temp <= Shield_Temp - 50°C.
- Low Temperature Limit :
Thermal chamber temperature should not be below 0°C.
Thermal protection
Thermal protection is used to avoid abnormalities while the
module is working, which will not be activated below 90 C
measured on shield of module.
Chapter 3 Pin Definitions
The following table describes the power pins for the AMD RZ608 integrated chip.
Table 6. Pin Definitions
Pin No.
Definition
Basic Description
Voltage
Type
1
GND
Ground
GND
2
VDD33
3.3 V power supply
3.3 V
VCC
3
USB_D_P
USB Differential signal
3.3 V
I/O
4
VDD33
3.3 V power supply
3.3 V
VCC
5
USB_D_N
USB Differential signal
3.3 V
I/O
6
LED_WLAN_L
Active low signal. The signal is used to
provide status indicators via LED
3.3 V
Output
7
GND
Ground
GND
16
LED_BE_L
Active low signal. The signal is used to
provide status indicators via LED
3.3 V
Output
17
NC
Floating Pin, does not connect to anything
Floating
18
GND
Ground
GND
19
NC
Floating Pin, does not connect to anything
Floating