Specifications

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15
m1805 Module Specification
6. Reflow and soldering
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
100°C
150°C
Preheat Temperature max (Tsmax)
150°C
200°C
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate (Tsmax to Tp)
3°C/second max
3°C/second max
Liquidous Temperature (TL)
183°C
217°C
Time (tL)Maintained Above (TL)
60-90 sec
30-90 sec
Peak Temperature (Tp)
220-235°C
230-250°C
Average ramp-down rate (Tp to Tsmax)
6°C/second max
6°C/second max
Time 25°C to peak temperature
6 minutes max
8 minutes max