Specifications

6.1 Reflow Solder temperature
Profile Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin） 100℃ 150℃
Preheat temperature max (Tsmax) 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) 3℃/second max 3℃/second max
Liquidous Temperature (TL) 183℃ 217℃
Time（tL）Maintained Above（TL） 60-90 sec 30-90 sec
Peak temperature（Tp） 220-235℃ 230-250℃
Aveage ramp-down rate （ Tp to
Tsmax）
6℃/second max 6℃/second max
Time 25℃ to peak temperature 6 minutes max 8 minutes max
6.1 Reflow Solder Curve
Chapter 7 FCC Instruction
Warning: Changes or modifications to this unit not expressly approved by the party
responsible for compliance could void the user’s authority to operate the equipment.