Specifications

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9. Environmental Requirements and Specifications TP Content
9.1 Temperature
9.1.1 Operating Temperature Conditions
The product shall be capable of continuous reliable operation when operating
in
ambient temperature of -20 ℃ to +60℃.
9.1.3 Non-Operating Temperature Conditions
Neither subassemblies shall be damaged nor shall the operational
performance be
degraded when restored to the operating temperature when exposed to
storage
temperature in the range of -45 ℃ to +135℃.
10. PCB Bending
The PCB bending spec shall be keep planeness under 0.1mm for both NATER
and
end assembly customer.
11. Handling environment
11.1 ESD
11.2 Terminals
The product is mounted with motherboard through half hole. In order to
prevent
poor soldering, please do not touch the pad by hand.
11.3 Falling
It will cause damage on the mounted components when the product is falling
or
receiving drop shock. It may cause the product mal-function.