Data Sheet

Table Of Contents

FSC‐BW226Datasheet

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 ShenzhenFeasycomTechnologyCo.,Ltd.www.feasycom.com

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Figure10:TypicalLead‐freeRe‐flow

Pre‐heatzone(A)—Thiszoneraisesthetemperatureatacontrolledrate,typically0.5–2C/s.Thepurposeofthis

zone is to preheat the PCB board and components to 120 ~ 150 C.This stage is required to distribute the heat

uniformlytothePCBboardandcompletelyremovesolventtoreducetheheatshocktocomponents.

Equilibrium Zone 1 (B) — Inthis stage the flux becomessoft and uniformlyencapsulatessolderparticlesandspread

overPCBboard,preventingthemfrombeingre‐oxidized.Alsowithelevationof

temperatureandliquefactionofflux,

eachactivatorandrosingetactivatedandstarteliminatingoxidefilmformedonthesurfaceofeachsolderparticleand

PCBboard.Thetemperatureisrecommendedtobe150to210for60to120secondforthiszone.

Equilibrium Zone 2 (C) (optional)

—Inordertoresolvetheuprightcomponentissue,itisrecommendedtokeepthe

temperaturein210–217forabout20to30second.

ReflowZone(D)—TheprofileinthefigureisdesignedforSn/Ag3.0/Cu0.5.Itcanbeareferenceforotherlead‐free

solder.The

peaktemperatureshouldbehighenoughtoachievegoodwettingbutnotsohighastocausecomponent

discolorationordamage.Excessivesolderingtimecanleadtointermetallicgrowthwhichcanresultinabrittlejoint.The

recommended peak temperature (Tp) is 230 ~ 250 C.The soldering time should

 be 30 to 90 second when the

temperatureisabove217C.

CoolingZone(E)—Thecoolingateshouldbefast,tokeepthesoldergrainssmallwhichwillgivealonger‐lastingjoint.

Typicalcoolingrateshouldbe4C.

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