Data Sheet
Table Of Contents
FSC‐BW226Datasheet
ShenzhenFeasycomTechnologyCo.,Ltd.www.feasycom.com
‐18‐
6.MSL&ESD
Table12:MSLandESD
Parameter Value
MSLgrade: MSL3
ESDgrade:
HumanBodyModel:Class‐2
MachineModel:Class‐B
7.RECOMMENDEDTEMPERATUREREFLOWPROFILE
Priortoanyreflow,itisimportanttoensurethemoduleswerepackagedtopreventmoistureabsorption.Newpackages
containdesiccate(toabsorbmoisture)andahumidityindicatorcardtodisplaythelevelmaintainedduringstorageand
shipment.If directedtobakeunitson thecard, please check the belowTable
18and followinstructionsspecified by
IPC/JEDECJ‐STD‐033.
Note:Theshippingtraycannotbeheatedabove65°C.Ifbakingisrequiredatthehighertemperaturesdisplayedinthe
belowTable13,themodulesmustberemovedfromtheshippingtray.
Anymodulesnotmanufacturedbeforeexceedingtheirfloor
lifeshouldbere‐packagedwithfreshdesiccateandanew
humidityindicatorcard.FloorlifeforMSL(MoistureSensitivityLevel)3devicesis 168hoursinambientenvironment
30°C/60%RH.
Table13:
Recommendedbakingtimesandtemperatures
MSL
125°CBakingTemp. 90°C/≤5%RHBakingTemp. 40°C/≤5%RHBakingTemp.
Saturated@
30°C/85%
FloorLifeLimit
+72hours@
30°C/60%
Saturated@
30°C/85%
FloorLifeLimit
+72hours@
30°C/60%
Saturated@
30°C/85%
FloorLifeLimit
+72hours@
30°C/60%
3 9hours 7hours 33hours 23hours
13days 9days
Feasycom surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperaturesduringreflowmeettherequirementsofthesolderpaste.Feasycomsurfacemountmodulesconformto
J‐STD‐020D1standardsforreflowtemperatures.
The soldering profile depends on various parameters necessitating a set up for each application.The data here is
givenonlyforguidanceonsolderreflow.