Data Sheet

FSC‐BT630Datasheet
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 ShenzhenFeasycomTechnologyCo.,Ltdwww.feasycom.com
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TypicalLead‐freeRe‐flow
Pre‐heatzone(A)—Thiszoneraisesthetemperatureatacontrolledrate,typically0.5–2C/s.Thepurposeofthis
zone is to preheat the PCB board and components to 120 ~ 150 C.This stage is required to distribute the heat
uniformlytothePCBboardandcompletelyremovesolventtoreducetheheatshocktocomponents.
Equilibrium Zone 1 (B)—Inthisstage thefluxbecomessoftanduniformlyencapsulatessolderparticles andspread
overPCBboard,preventingthemfrombeingre‐oxidized.Alsowithelevationoftemperatureand
liquefactionofflux,
eachactivatorandrosingetactivatedandstarteliminatingoxidefilmformedonthesurfaceofeachsolderparticleand
PCBboard.Thetemperatureisrecommendedtobe150to210for60to120secondforthiszone.
Equilibrium Zone 2(C) (optional) —In
ordertoresolvetheuprightcomponentissue,itisrecommendedtokeepthe
temperaturein210–217forabout20to30second.
ReflowZone(D)—TheprofileinthefigureisdesignedforSn/Ag3.0/Cu0.5.Itcanbeareferenceforotherlead‐free
solder.Thepeaktemperature
shouldbehighenoughtoachievegoodwettingbutnotsohighastocausecomponent
discolorationordamage.Excessivesolderingtimecanleadtointermetallicgrowthwhich canresultinabrittlejoint.The
recommended peak temperature (Tp) is 230 ~ 250 C.The soldering time should be 30
 to 90 second when the
temperatureisabove217C.
CoolingZone(E)—Thecoolingateshouldbefast,tokeepthesoldergrainssmallwhichwillgivealonger‐lastingjoint.
Typicalcoolingrateshouldbe4C.
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