User's Manual

B-LINK ELECTRONIC CO., LTD in shenzhen
9
6. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3.
Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C,
humidity < 70% RH, over 96 hours.
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4.
Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The
calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity
indicator cards must be blue, <30%.