User's Manual
B‐LINKELECTRONICCO.,LTDinshenzhen
2
1. GeneralDescription
BL‐R8782MS1 product AccordwithFCCCE andis a SDIO wireless module with smaller size,
high performance and high linearity output power consumption, specifically designed to support
high throughput data rates for next generation WLAN products. It is designed to supports IEEE
802.11g/band802.11npayloaddatarates.Itprovidesthecombinedfunctions ofDSSSandOFDM
basebandmodulation,MAC,CPU,memory,hostinterfaces,anddirectconversionWLANRFradioon
asingleintegratedchip.Forsecurity,Itsupports802.11isecuritystandardsthroughimplementation
oftheAES/CCMP,WEPwithTKIP,AES/CMAC,andWAPIsecuritymechanisms.Forvideo,voice,and
multimediaapplicationsis supported.It isalso equippedwitha coexistenceinterface for external,
co‐located2.4GHzradios,alsosupportedaSDIOinterfaceforconnectingWLANactivitytothehost
processor.
2. Therangeofapplying
Digital products (Printer, Digital camera, Digital photo frame)
Game player
Consumer electronic device and intelligent appliances (such as TV, DVD player, media player,
etc)
Table computer, notebook, E book
Smart phone and other mobile applications
3.Features
Feature Implementation
Powersupply
VCC_3.3V+‐0.2V
Clocksource
40MHz
Temperaturerange
Worktemperature:‐20ºC‐‐‐70ºC
Storagetemperature‐55°C~+125°C
Package
SMT14pins
WLAN features
Generalfeatures
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single‐chipintegrationof802.11wirelessradiobaseband,
MAC,CPU,memory,hostinterface
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CMOSandlow‐swingsinewaveinputclock
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19.2,26,38,4,and 40MHz crystal clock support with auto‐frequency
detectionifexternalsleepclockisavailable