User's Manual
B‐LINKELECTRONICCO.,LTDinshenzhen
8
4.TypicalSolderReflowProfile
5.Precautionsforuse
1.PlshandlethemoduleunderESDprotection.
2.Reflowsolderingshallbedoneaccordingtothesolderreflowprofile.Peaktemperature
245℃.
3.
Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C,
humidity<70%RH,over96hours.
Bakingcondition:125degreeC,12hours
Bakingtimes:1time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The
calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity
indicatorcardsmustbeblue,<30%.