WLAN 11b/g/n USB MODULE BL‐R8192EU6 Version: 0.1 Customer Date BL‐R8192EU6 Model Name Part NO.
B‐LINK ELECTRONIC CO., LTD in shenzhen Content Content.......................................................................................................................................................1 0. Revision History ......................................................................................................................................3 1. General Description..............................................................................................................................
B‐LINK ELECTRONIC CO., LTD in shenzhen FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
B‐LINK ELECTRONIC CO., LTD in shenzhen 0. Revision History Date 2015/08/22 Document Product revision revision V0.1 V0.1 Change Description Draft initial release 1. General Description BL‐R8192EU6 product is designed base on The Realtek RTL8192EU chipset . It uses a highly integrated single‐chip MIMO (Multiple In, Multiple Out) Wireless LAN (WLAN) solution for the wireless high throughput 802.11n specification. It combines a MAC, a 2T2R capable baseband, and RF in a single chip.
B‐LINK ELECTRONIC CO., LTD in shenzhen 3.2 Electrical and Performance Specification Item Description Product Name WLAN 11b/g/n USB MODULE Major Chipset RTL8192EU Host Interface USB2.0 Standard IEEE802.11b, IEEE 802.11g,IEEE 802.11n Frequency Range 2412‐2462MHz for 802.11b/g/n(HT20) ; 2422‐2452MHz for 802.11n(HT40) Modulation Type 802.11b: CCK, DQPSK, DBPSK 802.11g: 64‐QAM,16‐QAM, QPSK, BPSK 802.11n: 64‐QAM,16‐QAM, QPSK, BPSK Working Mode Infrastructure, Data Transfer Rate 1,2,5.
B‐LINK ELECTRONIC CO., LTD in shenzhen Antenna type Connect to the external antenna through the IPEX The transmit distance Indoor 100M, Outdoor 300M, according the local environment Dimension(L*W*H) 40.0x 20.0x 3.2mm (LxWxH) Tolerance:+/‐0.2mm Power supply 3.3V +/‐0.2V Power Consumption standby mode 30mA@3.3V , TX mode 190mA@3.3V Clock source 40.00MHz Working Temperature ‐10ºC to +50ºC Storage temperature ‐40°C ~ +85°C 3.3 DC Characteristic Terms Contents Specification : IEEE802.
B‐LINK ELECTRONIC CO., LTD in shenzhen 3.4 Product Photo TOP Bottom 3.5 Mechanical Specification Module dimension: Typical (W x L x H): 40.0mmx20.0mm x3.2mm 6 Tolerance : +/‐0.
B‐LINK ELECTRONIC CO., LTD in shenzhen 3.
B‐LINK ELECTRONIC CO., LTD in shenzhen 4. Typical Solder Reflow Profile 5. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4.
