BL-R8189RM2 802.11n 150Mbps SDIO WLAN Module Specification SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.
Top view Bottom view Module Name: BL-R8189RM2 Module Type: 802.11b/g/n 150Mbps SDIO WLAN Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision V1.0 1 Summary Release Date Initial release 2020-09-20 http://www.b-link.net.
1. Introduction BL-R8189RM2 product Accord with FCC CE and is 150 wireless SDIO adapter which has lower power consumption, high linearity output power, accords with IEEE802.11B/G/N, and supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It connects with other wireless device which accorded with these standards together, supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2.
1.3 General Specifications Module Name BL-R8189RM2 WiFi Module Chipset RTL8189ES WiFi Standards IEEE 802.11b, IEEE 802.11g,IEEE 802.11n Host Interface SDIO 1.1/ 2.0/ 3.0 Antenna Connect to the external antenna through the half hole Dimension 14*12.5*1.52mm (LxWxH), Tolerance: +-0.15mm Power Supply 3.3V +/-0.2V@360mA Operation Temperature -20℃ to +70℃ Operation Humidity 10% to 95% RH (Non-Condensing) 2. Pin Assignments (Top View) 2.
8 GND P Ground 9 ANT RF WLAN radio antenna pad 10 WAKE I/O WLAN wake 11 VIO I/O Power supply for I/O 12 VCC I/O VDD3.3V for digital IO 13 CS I/O Power down select P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Min Typ Max Units Ambient Operating Temperature -20 25 70 ℃ -- -- 3.1 3.3 3.
Channels Ch1~Ch11 802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11b: 1, 2, 5.5, 11Mbps; 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; Date Rate 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps; Frequency Tolerance ≦ ±25ppm 2.4G Transmitter Specifications (Ant0) TX Rate TX Power TX Power Tolerance EVM 802.11b@1~11Mbps 17dBm ±1.5dBm ≦-10dB 802.
5. Mechanical Specifications 5.1 Module Outline Drawing Top view Side view Module dimension: 14.0mm*12.5mm*1.52mm （L*W*H , Tolerance: ±0.15mm） Module Bow and Twist：≤0.1mm 6 http://www.b-link.net.
5.2 Mechanical Dimensions Top view Side view Bottom view Top view Reference PCB layout package design 7 http://www.b-link.net.
6. Application Information 6.1 Typical Application Circuit 6.2 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 8 http://www.b-link.net.
7. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset RTL8189ES Realtek Note Shen Zhen Tie Fa Technology limited 2 PCB BL-M8189RM2 Guangdong KINGSHINE ELECTRONICS CO., LTD Quzhou Sunlord Electronics Co., Ltd HUBEI TKD ELECTRONICS TECHNOLOGY CO., LTD. 3 Crystal 40MHz-15pF-15ppm LUCKI CM ELECTRONICS CO., LTD 8. Package and Storage Information 8.1 Package Dimensions 9 http://www.b-link.net.
Package specification: 1. 2000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a width of 24mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 5 boxes. 8.
9. FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
