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ShenZhen BiLian Electronic Manuals
Electronics
IEEE 802.11a/b/g/n/ac 867Mbps WLAN + Bluetooth v5.1 USBCombo Module
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Table Of Contents
1.Introduction
1.1Features
1.2Block Diagram
1.3General Specifications
2.Pin Assignments
2.1Pin Definition
3.Electrical and Thermal Specifications
3.1Recommended Operating Conditions
3.2 Current Consumption
4.WLAN & Bluetooth RF Specifications
4.12.4G WLAN RF Specification
4.25G WLAN RF Specification
4.3Bluetooth RF Specification
5.Mechanical Specifications
5.1Module Outline Drawing
5.2Mechanical Dimensions
6.Application Information
6.1Typical Application Circuit
6.2Recommend PCB Layout Footprint
(TOP View)
6.3 Reflow Soldering Standard Conditions
7.Key Components Of Module
8.Package and Storage Information
8.1Package Dimensions
8.2Storage Conditions
13http://www
.b-link.net.c
n
6.2
Recommend
PCB
Layout
Fo
otprint
(TOP
View)
6.3
Refl
ow
Soldering
Standard
Conditions
Please
use
the
reflow
within
2
times.
Set
up
the
highest
temp
erature
withi
n
250℃
.
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