Specifications

16 RX_EN LNA enable feet, high level effective
17 TX_EN PA enable feet, high level effective
18 RF_IRQ Output
Module interrupt signal output, low level
effective
19 RF_MISO Output Module SPI data output PIN
20 RF_MOSI Input Module SPI data input PIN
*Please refer to Ti authority《CC2500 Datasheet》for PIN definition of module,
software driver and communication protocol.
Notice
No Category Notice
1 Static
High frequency analog device
Avoid touching components on module if possible, since the
high frequency analog device features electrostatic susceptibility
2 Soldering
Electric soldering iron must be well connected to ground when
soldering
3 Power supply
Power supply quality influence on module performance, please
insure the power supply will not appear big ripple to avoid dither
in power supply.
4 Ground
Module ground apply single point grounding. It's recommended
to use ohm inductance or 10mH inductance and set it apart from
reference ground of other circuit in other part.
5 Antenna
Mounting structure of module antenna influence module
performance. Please insure little noise interference around
antenna. Note: Antenna must not mount in metallic shell,
otherwise the transmission distance be weakened greatly.
6 Interference
If there are different frequency modules inside one product, the
frequency should be well programmed to reduce the influence of
harmonic interference and intermediation interference
7 Oscillator
If there is oscillator close to the PCB in which module mount,
please increase the distance between oscillator and PCB if
possible.