Specifications

BT module Specification of LM-Q21-3031/3021 (based on QCC3031/3021)
深圳蓝奥声科技有限公司 Fax: [phone] Tel: [phone] Postcode: 518110
A1111-1113 Yinxing Hi-tech Building, No 1301 Guanguang Rd., Guanlan St., Longhua New Dist., Shenzhen, China
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1. Introduction
The LM-Q21-3031/3021 is a Bluetooth single-mode module with a built-in PCB antenna. This is a compact
and cost effective module capable of embedding into wired/wireless mono/stereo speaker applications.
The LM-Q21-3031/3021 is built on top of the Qualcomm chip QCC3031/3021. The only
difference between the two is that the QCC3031 supports Qualcomm ®aptX
™
audio (while the
QCC3021 does not). QCC3031/3021 is based on high performance Programmable Bluetooth ®
stereo Audio SoC, fully qualified single-chip dual-mode Bluetooth v5.1 system, tri-core processor
architecture, low power consumption, extended battery life.
Qualcomm ® QCC302x/QCC303x/QCC304x/QCC305x SoC series, the series including
specialized design options, in order to satisfy consumers' robust and functional demand increasingly
rich real wireless speaker, can support used throughout the day.
2. Features
QCC3021/3031 includes high-performance, analog, and digital audio codecs, Class-AB speaker driver,
advanced power management, Li-ion battery charger, light-emitting diode (LED) drivers, and flexible interfaces
including I²S, I²C, UART), and GPIOs.
· A small and cost effective Bluetooth® System.
· Qualified to Bluetooth® Specification V5.1 .
· 120 MHz Qualcomm ®Kalimba ™ audio DSP, 32 MHz Developer Processor for applications.
· Flexible QSPI flash programmable platform, Firmware Processor for system
· High-performance 24‑bit stereo audio interface, Digital and analog microphone interfaces.
· 1-mic Qualcomm® cVc™,speaker noise reduction and echo cancellation technology
· Flexible PIO controller and LED pins with PWM support
· Audio codecs support for SBC, AAC, QCC3031 additionally for aptX and aptX HD.
· Serial Interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0.
· Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery charger.
3. Applications
An application-dedicated Developer Processor and a system Firmware Processor run code from an external
quad serial peripheral interface (QSPI) flash. Both processors have tightly coupled memory (TCM) and an on-chip
cache for performance while executing from external flash memory. The Audio subsystem contains a
programmable Kalimba core running Qualcomm® Kymera ™ system DSP architecture framework, with audio
processing capabilities provided from ROM which are configurable.
The typical applications supporting for Bluetooth profiles A2DP v1.3.1, AVRCP v1.6, AVCTP v1.4, HFP
v1.7.1, HSP v1.2, SPP v1.2, DID v1.3 and Bluetooth low energy (LE) based on Bluetooth® Specification V5.1
enables rapid time-to-market for your audio products such as:
· Wired/wireless mono/stereo speakers
· Qualcomm TrueWireless™ stereo speakers
· Speaker phones
4. General Specifications