Specifications

BT module Specification of LM-Q21-3031/3021 (based on QCC3031/3021)
深圳蓝奥声科技有限公司 Fax: [phone] Tel: [phone] Postcode: 518110
A1111-1113 Yinxing Hi-tech Building, No 1301 Guanguang Rd., Guanlan St., Longhua New Dist., Shenzhen, China
深圳市龙华新区观澜观光路 1301 号银星科技大厦 8 楼 C802
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CONTENT
1. Introduction............................................................................................................................................... 3
2. Features ......................................................................................................................................................3
3. Applications................................................................................................................................................3
4. General Specifications............................................................................................................................... 3
5. System Architecture.................................................................................................................................. 4
6. Electrical Characteristics............................................................................................................................5
6.1. Absolute Maximum Ratings...................................................................................................................5
6.2. Radio Performance .................................................................................................................................5
6.3. Audio performance (Class-AB DAC audio output) ................................................................................ 5
6.4. Recommended Operating Conditions ................................................................................................... 5
7. Pin Configurations ......................................................................................................................................6
8. Mechanical Drawing .................................................................................................................................. 9
9. Recommended Temperature Reflow Profile ..........................................................................................10
10.
FCC Statement.........................................................................................................................................12
11.
IC Statement............................................................................................................................................12