Specifications

BT module Specification of LM-Q21-3031/3021 (based on QCC3031/3021)
深圳蓝奥声科技有限公司 Fax: [phone] Tel: [phone] Postcode: 518110
A1111-1113 Yinxing Hi-tech Building, No 1301 Guanguang Rd., Guanlan St., Longhua New Dist., Shenzhen, China
深圳市龙华新区观澜观光路 1301 号银星科技大厦 8 楼 C802
Page
10
of
14
9. Recommended Temperature Reflow Profile
Follow: IPC/JEDEC J-STD-020 C
Reference to conditions:
· Average ramp-up rate(217℃ to peak):1~2℃/sec max.
· Preheat:150~200C,60~180 seconds
· Temperature maintained above 217℃:60~150 seconds
· Time within 5℃ of actual peak temperature:20~40 sec.
· Peak temperature:250+0/-5℃ or 260+0/-5℃
· Ramp-down rate:3℃/sec.max.
· Time 25℃ to peak temperature:8 minutes max
· Cycle interval：5 minus
The re-flow profiles are illustrated in Figure 9-1 and Figure 9-2 below.
Figure 9-1. Typical Lead-free Re-flow Solder Profile