Specifications
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SHEN ZHEN DX-SMART TECHNOLOGY Manuals
Electronics
Bluetooth Module
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Table Of Contents
1.Introduction
1.1.Overview
1.2.Key Features
1.3.Application
1.4.Block Diagram
1.5.Basic Parameters
2.Application Interface
2.1.Module Pin Definition
2.2.Pin Definition Description
2.3.Operating Mode
2.4.Energy-saving Mode
2.4.1.Low Power Mode
2.4.2.Hibernation Mode
2.5.Power Design
2.5.1.Power Interface
2.5.2.Power Supply Stability Requirements
2.5.3.Power Down Requirements
2.5.4.RST Reset Pin Description
2.5.5.KEY Pin Definition
2.6.Hardware Physical Interface
2.6.1.UART Interface
2.6.2.Universal Digital IO Port
2.6.3.I2C Interface
2.6.4.SPI Interface
2.6.5.Analog-to-digital Converter（ADC）
3.Electrical Characteristics & Reliability
3.1.Maximum Rating
3.2.Working And Storage Temperature
3.3.Power Consumption
3.4.RF Characteristics
3.5.Static Protection
4.Mechanical Size And Layout Recommendations
4.1.Module Mechanical Size
4.2.Recommend Encapsulation
4.3.Module Top View & Bottom View
4.4.Hardware Design Layout Recommendations
5.Patch Requirements
5.1.Storage Conditions
5.2.Module Baking Treatment
5.3.Reflow Soldering
5.4.Packing Specification
DX
-B
T24-M
MODULE
SPECIFICA
TION
Shenzhen
DX-SMART
T
ec
hnology
Co
.,
Ltd.
www.sz
dx-smart.com
-
21
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4.1.
Module
Mechanical
Size
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18
19
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