Specifications

Practical tips
ProtoMat 95s/II 63
Note: We recommend that you punch-mark small diameter holes
before drilling. The MARKINGDRILLS phase in BoardMaster is
intended for this purpose and uses a special universal milling
cutter, the UNIVERSAL CUTTER 0,2 MM FOR MARKING.
•
Vitrification of the drilled hole
occurs as a result of the base
material melting when the drill remains in the hole too long after
the hole has been made.
These holes then cause problems for through-hole plating.
Reduce drilling times as appropriate.
•
Drills may break
where the drilling base has already been used
a number of times.
The drilling base should be changed for each new board.
The drill may break if it comes into contact with the edge of an
existing hole in the base.
Broken tools must be removed from the PCB and the drilling
base. Very thin drills may also break if the tool is too high above
the material.
•
Milling passes
created during film milling
will be uneven
if there
is air still trapped under the film.
The film may buckle after a while if
elastic adhesive tape
is
used to secure the film. It is particularly important that the milling
base is flat (LPKF engraving film backing).
•
Burrs
will be produced when milling film if either the tool is blunt
or milling is too deep.
•
Uniform misalignment
between the solder and component
sides occurs where the HOME position has not been
programmed accurately.
•
Increasing misalignment in the x-axis
between the solder and
component sides occurs where the registration hole system is no
longer parallel to the x-axis.
A new registration hole system will have to be drilled.