Operating instructions

T.able
6:1.
Reference
Designators
and
Abbreviations
degree
deviation
Deg
DEV
REFERENCE DESIGNATORS
A
assembly
ELECT.
BM balanced
mixer
ENCAP
B '
board
EXT
C .
capacitor
F
CH
chassis
F
Y
crystal
.
11M
DS
device,
indicating
FREQ
CR diode
Ge
V
electron
tube
GRD
E
electronic
part,
misc.
H
FL
filter
Harm
FP
front
panel
Hz
r ' ruse
Ie
HR
heater
IF
'.
Hz
hertz
INCD
L
inductor,
RF
choke
IN.
J
jack
INT
M
meter
K
P plug
LIN
RP
rear
panel
LO.
K relayII .
LOO.
R
resistor
LP
SCR
silicon
controlled
M
rectifier
MEG
LS
speaker
MFR
S
switch
MINAT
TB
terminal
.board
MY
TP
test
point
N
TF
thermal
fuse
P
RT
thermistor
PC
S
thermostat
pF
T
transformer
PlY
Q
transistor
POS
WT
wiring
tiepoint
POT.
ABBREVIATIONS
PP
p/o
AC
alternating
current
RECT
ADJ
adjust
REPL
AFC
automatic
frequency
RF
control
SB
AMP
amperes
SEC
AMPL
amplifier
Semicond
ANT.
antenna
Si
AUX
auxll
iary
Ta
BP
bandpass
TGL
C.
centigrade
TOL
CAL
calibrate
TRIM
CCW
counterclockwise
TYP
CER
.ceramlc '
coaxial
~
COAX.
UHF
COE'F
coefficient
V
COM
common
VAR
COMP
composition
VDCW
CONN
connector
VERT.
~
CRT
cathode-ray
tube
VHF
·CW
clockwise
W
CW
continuous wave
WW
DB
decibel
wi
DC
direct
current
w/o
6-2
5601··0015
electrolytic
encapsulated
.
external
fahrenheit
farad
frequency Tnoan\a\\tm
frequency
germanium
ground
henry
harmonic
.
hertz
integrated
circuit
intermediate
frequency
incandescent
inch
internal
kilo (10
3
)
linear
local
oscillator
logarithmic
lowpass .
milU (10-
3
j ,
mega (10
6
)
manufacture
miniature
mylar
nano (10-
9
)
peak
printed
circuit
picofarad (10-
1 2
)
peak
inverse
voltage
position(s)
.
potentiometer
peak-to-peak
part
of -
rectifier
replace
radio
frequency
slo-blo
second
semi
conductor
silicon
tantalum
toggle
tolerance
trimmer
typical
micro
(10
6
)
ultra
high frequency
volt
variable
dc working
volts
vertical
very
high frequency
watt
wire-wound
with
without
%
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