User`s manual

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Outline
(5) Lead inspection (Gray processing using a brightness filter)
(6) BGA/CSP inspection (Gray processing using a brightness filter)
- Inspection procedure
1 Determine the measurement points (K0 to K3) from the mid points of the leads
and the reference line.
2 Calculate the distances between the leads (D0 to D2) using the measurement
points.
3 Calculate the lead lengths (L0 to L3) from the measurement points (K0 to K3)
toward the lead measurement limit line.
Purpose
Example
Based on positional information obtained from the gray scale search function,
inspect the condition of the IC leads and connector pins. (No. of lead pins that can
be detected in one image: Max. 128.)
Application Inspect the IC leads and connector pins.
● Inspect the layout of the IC leads and connector pins
K0
Lead
Reference line
K1 K2 K3
D1D0
W0 W1 W2 W3
D2
L3 L0 L1 L2
[Lead inspection]
- Number of leads K
- D0 to D2: Distance
between
leads
- W0 to W3: Lead
width
- L0 to L3: Lead
length
Lead measurement
limit line
- Inspection procedure
● Measurement of 6 balls
Image
capture
Binary
conversion
Measure centers
of gravity
Fillet diameters
Object identification
(numbering)
Inspecting BGA/CSP solder balls.
Area of each
object
Ball size
Distance between centers
of gravity for pairs of balls
Distance between balls
Number of balls
Object 0 Object 1 Object 2
Object 3 Object 4 Object 5
Measure the center of gravity, area of each object, number of objects, and fillet
diameter using a color that was emphasized by the color filter function.
Purpose
Example
Application
[Measurement results]
- Number of objects: K
- Area of each object: R0 to R127
- Distance between centers of
gravity:
(DX0, DY0) to (DX127, DY127)
- Fillet diameters: FX, FY