Datasheet

DG-
MODEL No.
Page
ＧＷ５□□Ｃ１５Ｌ００ 14/14
⑤ Module surface strength
Module surface is subject to mechanical stress. Applying stress to surface of modules results in damage on resin,
and inside-failure.
⑥ Connecting method
In case of solder connecting method, apply solder to the leads
by soldering iron with thermo controller (tip temperature 380℃), within 10seconds per one place.
Put the board on materials whose conductivity is poor enough not to radiate heat of soldering.
Avoid touching yellow phosphor with soldering iron.
This product is not designed for reflow and flow soldering.
⑦ Static electricity
This product is subject to static electricity, so take measures to cope with it.
Install circuit protection device to drive circuit, if necessary.
⑧ Drive methods
Module is composed of LEDs connected in both series and parallel. Constant voltage power supply
runs off more than specified current amount due to lowered VF caused by temperature rise.
Constant current power supply is recommended to drive.
In designing a circuit, please make sure not to give reverse voltage to the LEDs at any time.
⑨ Cleaning
Avoid cleaning, since silicone resin is eroded by it.
⑩ Safety
Looking directly at LEDs for a long time may result in hurt your eyes.
In case that excess current(over ratings) are supplied to the device, hazardous phenomena including abnormal
heat generation, emitting smoke, or catching fire can be caused.
Take appropriate measures to excess current and voltage.
In case of solder connecting method, there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact.
Please confirm the safety standards or regulations of application devices.
※ This specification is reference.