Users Manual
Table Of Contents
- 1 Module Overview
- 1.1 Features
- 1.2 Description
- 1.3 Applications
- CONTENTS
- LIST OF FIGURES
- HISTORY
- 2 Hardware Introduction
- 2.1 Pin Layout
- 2.2 Pin Description
- 2.3 Physical Dimensions
- 2.4 On-board Chip Antenna
- 2.5 Ordering Information
- 3 Electrical Characteristics
- 3.1 Absolute Maximum Ratings
- 3.2 Recommended Operating Conditions
- 3.3 ESD
- 3.4 WiFi/BLE RF Standards
- 4 Peripheral Schematics
- 5 Product Handling
- 5.1 Reflow Profile
- 5.2 Storage Conditions
- 5.3 Device Handling Instruction (Module IC SMT Prepara
- 6 Contact Information
X-C13SL
802.11bgn and BLE SoC
Shanghai ChipFresh Internet of Things Technology Co., Ltd
14
Shelf life in sealed bag: 12 months, at <30
℃
and <60% relative humidity (RH).
Recommend to store at
≦
10% RH with vacuum packing.
The module is rated at the moisture sensitivity level (MSL) of 3.
5.3
Device Handling Instruction (Module IC SMT Preparation)
Baked required with 24 hours at 125±5
℃
before rework process.
After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
Recommend to oven bake with N2 supplied
Recommend end to reflow oven with N2 supplied
If SMT process needs twice reflow:
(1) Top side SMT and reflow (2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168
hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Note: Window time means from last bake end to next reflow start that has 168 hours space.