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X-C13SG

802.11bgn and BLE SoC

Shanghai ChipFresh Internet of Things Technology Co., Ltd

X-C13SG User manual

Based on RISC󶁓V SOC

Support Wi-Fi (802.11b/g/n) and BLE5.0 Wireless Standards

www.chipfresh.com

Summary of content (16 pages)

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X-C13SG 802.11bgn and BLE SoC X-C13SG User manual Based on RISCV SOC Support Wi-Fi (802.11b/g/n) and BLE5.0 Wireless Standards www.chipfresh.com Shanghai ChipFresh Internet of Things Technology Co.
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X-C13SG 802.11bgn and BLE SoC 1 Module Overview 1.1 Features MCU • Support PCB /IPEX Antenna Option • TG7100C embedded,32-bit RISC-V single-core BLE processor • 160 MHz CPU • Operation Frequency： 2402-2480MHz • 276 KB RAM • Transmit Power（10.30 dBm(BLE)） • 128 KB ROM • Receiver Sensitivity（-97 dBm） • 1 Kb eFuse • Advertising extensions Wi-Fi • IEEE 802.11 b/g/n-compliant • Operation Frequency： 2412-2462MHz（802.11b/g/n ht20） • Supports 20 MHz bandwidth in 2.
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X-C13SG 802.11bgn and BLE SoC 1.2 Description X-C13SG is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi and BLE baseband/MAC designs, which provide a wireless interface to any equipment with a serial or other interface for data transfer. X-C13SG integrate MAC, base band processor, RF transceiver in hardware and all Wi-Fi protocol and configuration functionality and networking stack, embedded firmware to make a fully self-contained solution for a variety of applications. 1.
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X-C13SG 802.11bgn and BLE SoC CONTENTS 1 MODULE OVERVIEW....................................................................................................................................... 2 1.1 FEATURES..................................................................................................................................................... 2 1.2 DESCRIPTION.........................................................................................................................................
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X-C13SG 802.11bgn and BLE SoC LIST OF FIGURES FIGURE 1. X-C13SG PIN LAYOUT (TOP VIEW).................................................................................................7 FIGURE 2. X-C13SG PHYSICAL DIMENSIONS.................................................................................................8 FIGURE 3. SUGGESTED MODULE PLACEMENT REGION.................................................................................. 9 FIGURE 4. ORDERING INFORMATION................................
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X-C13SG 802.11bgn and BLE SoC LIST OF TABLES TABLE1. PINS DEFINITION..................................................................................................................................7 TABLE2. ABSOLUTE MAXIMUM RATINGS........................................................................................................10 TABLE3. RECOMMENDED OPERATING CONDITIONS......................................................................................10 TABLE4. ESD...............................
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X-C13SG 802.11bgn and BLE SoC 2 Hardware Introduction Pin Layout 2.1  X-C13SG comes with a on-board PCB antenna, please refer to Figure 2. Figure 2. X-C13SG Pin Layout (Top View) Pin Description 2.2 The module has 23 pins. See pin definitions in Table 1. Pin Describtion Type 1,8,14,16,23 Ground P I IPU/O I SPI, DAC, ADC 3.3V TTL UART0 Communication Input O,PU 3.3V TTL UART0 Communication Output I/O IPU/O SPI, PWM.
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X-C13SG 802.11bgn and BLE SoC 11 12 13 15 17 18 19 20 21 22 GPIO3 Factory GPIO4 Ready GPIO5 Link +3.3V GPIO22 GPIO0 GPIO2 GPIO21 GPIO20 UART1_TX GPIO17 IPU press this button ( “Low” > 4s ) and loose to make the module recover to factory setting. “0” – Boot-up OK; “1” – Boot-up Fail; O “0” – Wi-Fi connect to router “1” – Wi-Fi unconncted; The maximum output current of the external power supply is recommended to be above 500mA. SPI,PWM SPI,PWM SPI,PWM SPI,PWM SPI,PWM 3.
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X-C13SG 802.11bgn and BLE SoC 2.4 PCB Antenna X-C13SG support internal PCB antenna option.
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X-C13SG 802.11bgn and BLE SoC 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Parameter Power supply voltage I/O PIN Storage temperature Symbol VDD - Min -0.3 -0.3 -40 Table2. 3.2 Absolute Maximum Ratings Symbol VDD - Table3. Min 2.1 -40 Type 3.3 - Max 3.6 85 Unit V ℃ Typ +/- 2000 2 +/-500 Unit V V Recommended Operating Conditions ESD Name ESD-HBM ESD-MM ESD-CDM Description Human body model class 2 Moisture sensitivity level Charge device model Table4. 3.
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X-C13SG 802.11bgn and BLE SoC Product Handling 4 Reflow Profile 4.1 Solder the module in a single reflow. ℃ Peak Temp. 235 ~ 250 ℃ 250 217 200 Cooling zone Preheating zone Reflow zone 150 ~ 200 ℃ 60 ~ 120 s >217 ℃ 60 ~ 90s –1 ~ –5 ℃/s Soldering time > 30 s Ramp-up zone 1 ~ 3 ℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.
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X-C13SG 802.11bgn and BLE SoC 5.2 5.3 Storage Conditions  Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH).  Recommend to store at ≦10% RH with vacuum packing.  The module is rated at the moisture sensitivity level (MSL) of 3. Device Handling Instruction (Module IC SMT Preparation)  Baked required with 24 hours at 125+-5℃ before rework process.  After bag is opened, devices that will be re-baked required after last baked with window time 168 hours.
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X-C13SG 802.11bgn and BLE SoC 7 Contact Information Address: Room 1315, #2 Building, No.268 Zhouzhu Road, Pudong District, Shanghai,China Web: www.chipfresh.com Sales Contact: sales@chipfresh.com This document contains information that is proprietary to Shanghai ChipFresh Inc. Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. Shanghai ChipFresh Internet of Things Technology Co.
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FCC Statement： Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference,and (2) this device must accept any interference received, including interference that may cause undesired operation.
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OEM Guidance 1. Applicable FCC rules This module is granted by Single Modular Approval. It complies to the requirements of FCC part 15C, section 15.247 rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 2.7 ~ 3.6 V DC. The operational ambient temperature of the module is -40 to 85 degree C. Only the embedded PCB antenna is allowed. Any other external antenna is prohibited. 3.Limited module procedures N/A 4.
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6. Antenna Antenna type :PCB Antenna; Antenna Max. Peak Gain 2 dBi 7. Label and compliance information An exterior label on OEM’s end product can use wording such as the following: “Contains FCC ID:2A3M5-X-C13SG ” 8.