User's Manual
Table Of Contents
- Revision History
- Introduction
- Package Information
- Interface Application
- RF Specifications
- Electrical Specifications
- SMT Production Guide
- Packaging
- Appendix
Smart Machine Smart Decision
SIM7500A_User Manual_V1.022016-09-29
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Table 35: The Description of Label Information
No.
Description
A
LOGO
B
No.1 Pin
C
Project Name
D
Part Number
E
Serial Number (SN)
F
International Mobile Equipment Identity (IMEI)
G
FCC ID
H
QR code
6.3 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 33: The ramp-soak-spike Reflow Profile of Module
Note: For more details about secondary SMT, please refer to the document [21].
6.4 Moisture Sensitivity Level (MSL)
Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.