User's Manual

Smart Machine Smart Decision
SIM5320A_Hardware Design_V1.01 2011-2-29
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Figure 46: The ramp-soak-spike reflow profile of SIM5320A
For details about secondary SMT, please refer to document [26].
6.3 Moisture Sensitivity Level (MSL)
SIM5320A is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-020.
After the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment
(<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not
heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged.
6.4 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.18mm.