User's Manual

Application Note [Page 17]
EMW3166_Guide For User Design
Figure 12 Testing Results
Statements 3.4
 MXCHIP has the obligation to guarantee there is no quality problem for the module delivered at each
batch.
 If problems are found while sampling module, customer has the right to require MXCHIP to give a timely
replacement.
 If problems are found after welding the module on mother board without any warehousing detection,
MXCHIP is only responsible for the compensation of module.
 MXCHIP has the obligation to assist solving various technical problems, without retaining any MVA/BIN
file of customer.
 Customer has the obligation to record every firmware version during the firmware developing work and
use the proper firmware for production.
version
Liblary version
Application version
Driver version
MAC Address
Hotspot Name
signal strength