User's Manual
Table Of Contents
Application Note [Page 10]
EMW3166_Guide For User Design
2. Hardware design attention
Mechanical dimensions 2.1
EMW3166mechanical dimension of vertical view:
Figure 3 Vertical view
EMW3166 mechanical dimension of side view:
Figure 4 side view
Recommended package design 2.2
The figure followed below is the recommended package design MXCHIP suggested while designing the baseplate.
The solder window has the same size of the pad.