Data Sheet

Datasheet
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5. Assembly Information and Production Guidance
Production Guidance
⚫ The stamp hole package module produced by Mxchip must completely being patched by SMT machine
in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping
and drying before patch.
▪ Devices for SMT patch:
（1）Reflow soldering machine
（2）AOI detector
（3）Suction nozzle with 6-8mm caliber
▪ Device for drying:
（1）Cabinet type oven
（2）Anti-static and high thermos tolerant tray
（3）Anti-static and high thermos tolerant gloves
⚫ Conditions of product storage (Storage environment is shown in figure 8):
▪ Moisture bag must be stored in temperature below 30 and humidity less than 85%RH.
▪ Dry packaging products, the guarantee period should be from 6 months date of packing seal.
▪ Humidity indicator card is in the hermetic package.
Figure 7 Humidity Card
⚫ Humidity indicator card and drying situation:
▪ 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue after
unpacking;
▪ 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking;
▪ 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after
unpacking;