User's Manual
Table Of Contents
19
color ring, need to continue to bake for 14 hours module;
z Baking parameters are as follows:
Baking temperature: 125 ℃ + / - 5 ℃;
Set the alarm temperature as 130 ℃;
Under the condition of natural cooling < 36 ℃, SMT placement can be made;
Dry times: 1 times;
z If opened the time more than 3 months, please ban the use of SMT process welding this batch
module, zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is
likely to cause virtual welding, welding, the resulting problems we do not assume
corresponding responsibility.
z Please to ESD(static discharge,static electricity discharge) protection module before SMT;
z Please according to the SMT reflow soldering curve, peak temperature 245 ℃, reflow soldering
temperature curve as shown in figure 11,section 5.5.
z For the first time in order to ensure the qualified rate of reflow soldering, first SMT please
extraction 10% product to visual analysis, AOI inspection, to ensure that the furnace
temperature control, device adsorption method, the rationality of the put way; Suggestions:
when batch production per hour 5-10 pieces of visual analysis, AOI test.
5.3. The matters needing attention
z In the entire production, Each station of the operator must wear anti-static gloves;
z When baking, no more than baking time;
z When roasting, it is forbidden to join explosive, flammable, corrosive substances;
z When baking, high temperature module application tray in the oven, keep the air circulation
between each module, at the same time avoid direct contact with the oven wall module;
z Baking, please will bake the door is closed, the guarantee baking box sealing, prevent leakage,
temperature influence the baking effect;