Data Sheet
Manuals
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Shanghai MXCHIP Information Technology Manuals
Electronics
Embedded WiFi module
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Table Of Contents
Abstract
Version Illustration
1. Product Introduction
1.1 EMW3080V2 Label Information
1.2 Pin Arrangement
1.3 Pin Definition
1.3.1 EMW3080V2 Package Definition
1.3.2 EMW3080V2 Pin Definition
2. Electrical Parameters
2.1 Operating Conditions
2.2 Power Consumption
2.3 Working Environment
2.4 Electrostatic Discharge
3. RF parameters
3.1 Basic RF parameters
3.2 TX Performance
3.2.1 Transmit performance of IEEE802.11b mode
3.2.2 Transmit performance of IEEE802.11g mode
3.2.3 Transmit performance of IEEE802.11n-HT20 mode
4. Antenna Information
4.1 Antenna Type
4.2 PCB Antenna Clearance Zone
4.3 External Antenna Connector
5. Assembly Information and Production Guidance
5.1 Assembly Size
5.2 Production Guidance（Important）
5.3 Considerations
5.4 Storage Condition
5.5 Temperature Curve of Secondary Reflow
6. Reference Circuit
7. Module MOQ and Package Information
8. FCC & IC Information
8.1 FCC Warning
8.2 IC warning
9. Sales Information and Technical Support
Datash
ee
t
[Page
21]
EMW3080V2
T
em
perature Curve of Secondary
Refl
ow
Sugges
t
ed solde
r
paste ty
pe: SAC305,
unleaded, solder paste thickness f
r
o
m
0.12
to
0.
15
,
les
s th
an 2 times
r
ef
low
.
Figure 12 T
emperatu
re Curve of
Secondar
y
Refl
ow
1
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...
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