Data Sheet

Datasheet [Page 18]
EMW3080V2
Production Guidance（Important）
The stamp hole package module produced by Mxchip must completely being patched by SMT machine in 24 hours
after open firmware package. Otherwise the module should be re-package by vacuum pumping and drying before
patch.
▪ Devices for SMT patch:
（1）Reflow soldering machine
（2）AOI detector
（3）Suction nozzle with 6-8mm caliber
▪ Device for drying:
（1）Cabinet type oven
（2）Anti-static and high thermos tolerant tray
（3）Anti-static and high thermos tolerant gloves
Conditions of product storage (Storage environment is shown in Figure 11:
▪ Moisture bag must be stored in temperature below 30 and humidity less than 85%RH.
▪ Dry packaging products, the guarantee period should be from 6 months date of packing seal.
▪ Humidity indicator card is in the hermetic package.
Figure 10 Humidity Card
⚫ Humidity indicator card and drying situation:
▪ 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue after
unpacking;
▪ 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking;