User's Manual

MXCHIP All Rights Reserved
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Datasheet [Page 20]
EMW3080
after unpacking.
 Drying parameters:
 Drying temperature: 125℃±5℃；
 Alarm temperature:130℃；
 SMT patch when the device cool down below 36℃ in natural condition;
 Dry times: 1;
 Please dry again if the module is unsoldering in 12 hours after last drying.
 SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad
because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the
corresponding responsibility;
 ESD protection is required before SMT;
 SMT patch should on the basis of reflow profile diagram, maximum temperature 245℃, reflow profile
diagram is shown in figure 10;
 In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in
10% products for the first patch to make sure the rationality of temperature control, device adsorption mode
and position. Detect 5 to 10 sample every hour in the following batch production.
5.3 Considerations
 Operator should wear anti-static gloves during producing;
 No more than drying time;
 Any explosive, flammable and corrosivematerial is not allowed to add in drying;
 Module should be put into oven with high thermotolerant tray. Ventilation should exist between each
module and no direct contact with oven;
 Make sure oven is closed when drying to prevent temperature leaking;
 Reduce opening time or keep closing the door of the oven during drying;
 Use anti-static glove to take out module when its temperature below 36℃by natural cool down after
drying;
 Make sure no water and dirt in the bottom of the module;
 Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based
on IPC/JEDEC J-STD-020.