User's Manual

MXCHIP All Rights Reserved
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Datasheet [Page 19]
EMW3080
5.2 Production Guidance（Important）
 The stamp hole package module produced by Mxchip must completely being patched by SMT machine
in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping
and drying before patch.
 Devices for SMT patch:
（1）Reflow soldering machine
（2）AOI detector
（3）Suction nozzle with 6-8mm caliber
 Device for drying:
（1）Cabinet type oven
（2）Anti-static and high thermotolerant tray
（3）Anti-static and high thermotolerant gloves
 Conditions of product storage (Storage environment is shown in figure 8):
 Moisture bag must be stored in temperature below 30 and humidity less than 85%RH.
 Dry packaging products, the guarantee period should be from 6 months date of packing seal.
 Humidity indicator card is in the hermetic package.
Figure8Humidity Card
 Humidity indicator card and drying situation:
 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue
after unpacking;
 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after
unpacking;
 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after
unpacking;
 12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink