Data Sheet

Table Of Contents

EMW3076 Series Wireless Module Data Manual

If the disassembly time exceeds 3 months, SMT process is forbidden to weld this batch of modules,

because PCB gold deposition process, over 3 months, pad oxidation is serious, SMT patch is likely to lead

to virtual welding, leak welding, resulting in various problems, our company does not assume the

corresponding responsibility;

Before SMT patch, ESD (Electrostatic Discharge, Electrostatic Release) protection should be applied to

the module.

SMT patches should be made according to the reflow curve. The peak temperature is 250 C. The reflow

temperature curve is shown in Chapter 11, Figure 15 Typical Secondary Reflow Temperature Curve.

In order to ensure the qualified rate of reflow soldering, 10% of the first patches should be taken for

visual inspection and AOI testing to ensure the rationality of furnace temperature control, device

adsorption mode and placement mode, and 5-10 patches per hour are recommended for visual

inspection and AOI testing in subsequent batch production.

Precautions

⚫ Operators of each station must wear static gloves during the entire production process;

⚫ Do not exceed the baking time when baking;

⚫ It is strictly forbidden to add explosive, flammable or corrosive substances during baking;

⚫ When baking, the module uses a high temperature tray to be placed in the oven to keep the air

circulation between each module while avoiding direct contact between the module and the inner

wall of the oven;

⚫ When baking, please close the oven door to ensure that the oven is closed to prevent temperature

leakage and affect the baking effect.

⚫ Try not to open the door when the oven is running. If it must be opened, try to shorten the time for

opening the door;

⚫ After baking, the module should be naturally cooled to <36 °C before wearing the static gloves to

avoid burns;

⚫ When operating, strictly guard against water or dirt on the bottom of the module;

The temperature and humidity control level of MXCHIP factory module is Level3, and the storage and

baking conditions are based on IPC/JEDEC J-STD-020.

Secondary Reflow Temperature Curve

Solder paste type is recommended: SAC305, lead free. The number of reflows does not exceed 2 times.

The peak temperature does not exceed 245 °C. The following is a typical furnace temperature profile

setting.

Table 12 Typical Furnace Temperature Setting

Welding

furnace setting

Z10