Data Sheet
Table Of Contents
- Abstract
- 1. Introduction
- 2. Pin Definition
- 3. Memory Space Allocation
- 4. Work Mode Selection
- 5. Electrical Parameter
- 6. Antenna Information
- 7. Assembly Size and PCB Package
- 8. Reference Circuits and Typical Applications
- 9. FCC and IC Information
- 10. Production Guidelines
- Appendix 1: Sales and Technical Support Information
EMW3076 Series Wireless Module Data Manual
Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
15
Production Guidelines
MXCHIP stamp port packaging module must be SMT machine patches, module humidity sensitivity
grade MSL3, after unpacking more than a fixed time patches to bake module.
⚫ SMT patches require instruments
▪ Reflow bonding machine
▪ AOI detector
▪ 6-8mm suction nozzle
⚫ Baking requires equipment:
▪ Cabinet oven
▪ Anti-static, high temperature tray
▪ Antistatic and heat resistant gloves
The storage conditions of MXCHIP module are as follows:
▪ Moisture-proof bags must be stored in an environment with temperature < 30 degree C and
humidity < 85% RH.
▪ A humidity indicator card is installed in the sealed package.
Figure 14 Humidity Card
After the module is split, if the humidity card shows pink, it needs to be baked.
The baking parameters are as follows:
▪ The baking temperature is 120 5 and the baking time is 4 hours.
▪ The alarm temperature is set to 130 C.
▪ SMT patches can be made after cooling < 36 C under natural conditions.
▪ Drying times: 1 time.
▪ If there is no welding after baking for more than 12 hours, please bake again.