Data Sheet

Datasheet [Page 18]
EMW3072
⚫ If opened the time more than 3 months, please ban the use of SMT process welding this batch module,
zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is likely to cause virtual
welding, welding, the resulting problems we do not assume corresponding responsibility.
⚫ Please to ESD（static discharge，static electricity discharge） protection module before SMT;
⚫ Please according to the SMT reflow soldering curve, peak temperature 245 ℃, reflow soldering
temperature curve as shown in figure 10, section 5.5;
⚫ For the first time in order to ensure the qualified rate of reflow soldering, first SMT please extraction
10% product to visual analysis, AOI inspection, to ensure that the furnace temperature control, device
adsorption method, the rationality of the put way; Suggestions：when batch production per hour 5-10 pieces
of visual analysis, AOI test.
The matters need attention
⚫ In the entire production, each station of the operator must wear anti-static gloves;
⚫ When baking, no more than baking time;
⚫ When roasting, it is forbidden to join explosive, flammable, corrosive substances;
⚫ When baking, high temperature module application tray in the oven, keep the air circulation between each
module, at the same time avoid direct contact with the oven wall module;
⚫ Baking, please will bake the door is closed, the guarantee baking box sealing, prevent leakage, temperature
influence the baking effect;
⚫ Don't open the door, as far as possible when baking box running if must open, shortening the time of can open
the door as far as possible;
⚫ After baking, must be natural cooling modules to < 36 ℃ before wearing anti-static gloves out, so as not to
burn.
⚫ Operation, forbidden module bottom touch water or dirt;
⚫ Temperature and humidity control level for Level3, storage and baking conditions based on IPC/JEDEC J -
STD - 020.