Data Sheet
Table Of Contents
- Abstract
- Version Record
- 1. Product Introduction
- 2. Electrical Parameters
- 3. RF Parameters
- 4. Antenna Information
- 5. Production Instruction
- 6. Reference Circuit
- 7. FCC and IC Information
- 8. Module MOQ and packaging information
- 9. Sales Information and Technical Support
Datasheet [Page 17]
EMW3072
5. Production Instruction
Production Guidelines
Qingke stamp port packaging module must be SMT machine patches, module humidity sensitivity grade MSL3, after
unpacking more than a fixed time patches to bake module.
SMT need machine:
1. Reflow soldering SMT machine
2. The AOI detector
3. 6-8 mm diameter suction nozzle
Baking need equipment:
1. Cabinet baking box
2. The antistatic, high temperature resistant tray
3. The antistatic high temperature resistant gloves
Storage conditions as follows:
1. Moisture bag must be stored in a temperature < 30 ° C, humidity 85% RH of the environment.
2. Dry packaging products, the guarantee period should be from 6 months from the date of packing seal.
Figure 7 Humility Card
⚫ After the module is split, if the humidity card shows pink, it needs to be baked.
⚫ Baking Parameters:
▪ Roasting temperature: 12℃±5℃and baking time: 4 hours.
▪ The alarm temperature is set to 130 C.
▪ SMT patches can be prepared after cooling < 36 C under natural conditions.
▪ Drying times: 1 time.
▪ If there is no welding after baking for more than 12 hours, please bake again.