Data Sheet
Table Of Contents
- Abstract
- 1. Introduction
- 2. Characteristics
- 3. Pin Definition
- 4. System memory Space
- 5. ATE（RF Test Mode）
- 5.1. Wi-Fi ATE Command
- 5.1.1. Start MP mode
- 5.1.2. Stop MP mode
- 5.1.3. Set Tx rate
- 5.1.4. Set operational channel
- 5.1.5. Set operational bandwidth
- 5.1.6. Set Tx power
- 5.1.7. Set antenna for Tx
- 5.1.8. Set antenna for Rx
- 5.1.9. Start air Rx mode
- 5.1.10. Start continuous Tx mode
- 5.1.11. Query air Rx statistics
- 5.1.12. Reset air Tx/Rx statistics
- 5.2. Bluetooth ATE Command（TBD）
- 5.3. Example Command
- 5.1. Wi-Fi ATE Command
- 6. Flash Programming
- 7. Electrical Parameters
- 8. RF Parameter
- 9. Antenna Information
- 10. Dimensions and Production Guidance
- 11. Production Guidelines
- 12. FCC and IC Information
- 12.1. FCC Warning
- 12.2. IC warning
- 12.3. Trace antenna designs
- 12.4. RF exposure considerations
- 12.5. Antennas
- 12.6. Label and compliance information
- 12.7. Information on test modes and additional testing requirements5
- 12.8. Additional testing, Part 15 Subpart B disclaimer
- 12.9. The module is limited to OEM installation ONLY.
- 12.10. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module.
- 12.11. The module is limited to installation in mobile or fixed applications
- 13. Packaging and Label Information
- 14. Sales and Technical Support Information
EMC3380 Series Wireless Module Data Manual
Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
46
Production Guidelines
MXCHIP stamp port packaging module must be SMT machine patches, module humidity sensitivity
grade MSL3, after unpacking more than a fixed time patches to bake module.
⚫ SMT patches require instruments
▪ Reflow bonding machine
▪ AOI detector
▪ 6-8mm suction nozzle
⚫ Baking requires equipment:
▪ Cabinet oven
▪ Anti-static, high temperature tray
▪ Antistatic and heat resistant gloves
The storage conditions of MXCHIP module are as follows:
▪ Moisture-proof bags must be stored in an environment with temperature < 30 degree C and
humidity < 85% RH.
▪ A humidity indicator card is installed in the sealed package.
Figure 14 Humidity Card
After the module is split, if the humidity card shows pink, it needs to be baked.
The baking parameters are as follows:
▪ The baking temperature is 120℃±5℃ and the baking time is 4 hours.
▪ The alarm temperature is set to 130℃.
▪ SMT patches can be made after cooling < 36℃ under natural conditions.
▪ Drying times: 1 time.
▪ If there is no welding after baking for more than 12 hours, please bake again.