Data Sheet
Table Of Contents
- Abstract
- 1. Introduction
- 2. Characteristics
- 3. Pin Definition
- 4. System memory Space
- 5. ATE(RF Test Mode)
- 5.1. Wi-Fi ATE Command
- 5.1.1. Start MP mode
- 5.1.2. Stop MP mode
- 5.1.3. Set Tx rate
- 5.1.4. Set operational channel
- 5.1.5. Set operational bandwidth
- 5.1.6. Set Tx power
- 5.1.7. Set antenna for Tx
- 5.1.8. Set antenna for Rx
- 5.1.9. Start air Rx mode
- 5.1.10. Start continuous Tx mode
- 5.1.11. Query air Rx statistics
- 5.1.12. Reset air Tx/Rx statistics
- 5.2. Bluetooth ATE Command(TBD)
- 5.3. Example Command
- 5.1. Wi-Fi ATE Command
- 6. Flash Programming
- 7. Electrical Parameters
- 8. RF Parameter
- 9. Antenna Information
- 10. Dimensions and Production Guidance
- 11. Production Guidelines
- 12. FCC and IC Information
- 12.1. FCC Warning
- 12.2. IC warning
- 12.3. Trace antenna designs
- 12.4. RF exposure considerations
- 12.5. Antennas
- 12.6. Label and compliance information
- 12.7. Information on test modes and additional testing requirements5
- 12.8. Additional testing, Part 15 Subpart B disclaimer
- 12.9. The module is limited to OEM installation ONLY.
- 12.10. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module.
- 12.11. The module is limited to installation in mobile or fixed applications
- 13. Packaging and Label Information
- 14. Sales and Technical Support Information
EMC3380 Series Wireless Module Data Manual
Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
20
System memory Space
The EMC338x module contains the following memory cells:
KM4 Embedded SRAM
The KM4 core contains up to 512K bytes of continuous on-chip SRAM memory. The embedded SRAM is
available in bytes (8 bits), half words (16 bits) or single words (32 bits). It is divided into two blocks, both
of which can be accessed by the KM4 and KM0 cores.
⚫ KM4 SRAM1 (up to 256KB)
⚫ KM4 SRAM2 (up to 256KB)
Dividing SRAM into two sending device ports allows users' applications to obtain better
performance. For example, it is possible to access the SRAM through the CPU and the DMA controller
simultaneously without causing delay. Generally, when the DMA is reading and writing data from the
peripheral to the SRAM, the CPU will also access the SRAM to read and write the data of other peripherals.
Therefore, the reading and writing of different peripheral data is placed in different SRAM blocks Can
reduce latency. In addition, SRAM is read and written alternately to access the same peripheral data
sequence. For example, when the DMA is reading or writing to a RAM buffer and is ready to operate on
the next buffer, the CPU is notified. In this way, the CPU and DMA can operate different buffers in
different SRAM blocks at the same time, reducing access latency.
In the power supply area, the entire SRAM is also divided into 3 blocks:
⚫ SRAM_PD1 (up to 256KB)
⚫ SRAM_PD2 (up to 128KB)
⚫ SRAM_PD3 (up to 128KB)
Each block can be individually enabled in the power management unit (PMU), and this SRAM can be
restored as quickly as possible when the system wakes up from sleep mode.
KM0 Embedded SRAM
The KM0 core contains up to 64K bytes of memory. The embedded SRAM is available in bytes (8
bits), half words (16 bits) or single words (32 bits) and accessible by KM4 and KM0 cores.
KM4 Extension SRAM
If Bluetooth is not used, the KM4 core can be expanded with an additional 64KB of SRAM. This SRAM
can also be accessed through KM4 and KM0 at speeds up to 50MHz * 32 bits.
Retention SRAM
The chip also provides 1KB of SRAM, which is used to save data with the lowest power consumption
in deepsleep mode. This SRAM can also be accessed by KM4 and KM0.