Data Sheet

EMC3080 Series Wireless Module Data Manual
Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
4
Table 15 RF TX Parameters in IEEE802.11n HT20 mode ......................................................................................... 13
Table 16 RF RX Parameters in IEEE802.11n HT20 mode ......................................................................................... 13
Table 17 EMC3080 BLE4.2 TX/RX Parameters .......................................................................................................... 14
Table 18 On-board PCB parameter ......................................................................................................................... 15
Figure Catalog
Figure 1 EMC3080 Hardware Block Diagram ............................................................................................................. 5
Figure 2 Pin Arrangement ............................................................................................................................................ 6
Figure 3 IO The power-on state interface................................................................................................................... 8
Figure 4 Antenna minimum clearance area (unit: mm) .......................................................................................... 15
Figure 5 Copper tube antenna size ............................................................................................................................ 16
Figure 6 Dimension drawing of external antenna connector ................................................................................ 16
Figure 7 Assembly Dimension Diagramunit: mm, tolerance: ±0.1, outside tolerance±0.2) ................... 17
Figure 8 DIP package dimension(unit: mm) ............................................................................................................. 17
Figure 9 Stamp hole package size (mounting pad, unit: mm) ............................................................................... 18
Figure 10 Stamp hole package size (no mounting pad, unit: mm) ....................................................................... 18
Figure 11 Humidity Card ............................................................................................................................................. 19
Figure 12 Storage Conditions Diagram..................................................................................................................... 21
Figure 13 Reference Secondary Reflux Temperature Curve .................................................................................. 22
Figure 14 Module Label Schematic Diagram ............................................................................................................ 24