Product Data Sheet

TSPM0424123 Product Datasheet
MS-RD60-GEN-04-A_EN Page 7/11
2.3 Precautions Hardware Design
⚫ Input power is recommended to use magnetic beads for filtering;
⚫ Copper plating, trace and component mounting are not allowed directly above/below the
PCB antenna, otherwise it will affect the RF performance. It is recommended to use the
Keep Out Layer to knock out this area;
⚫ Other components should be mounted away from the antenna to reduce the impact of
object occlusion on RF performance. It is recommended to arrange the antenna at the
outermost periphery of the whole board PCB;
⚫ Metal casing may shield RF electromagnetic waves and affect RF performance. If the RF
performance requirements are high, metal casing should be avoided as much as possible,
or use a module with an external antenna to lead the antenna to the outside of the metal
casing.