Specifications

L506 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 7
4.2.3 current consumption .................................................... 53
4.3 Working and storage temperature ....................................................................................................... 54
4.4 ESD performance .................................................................................................................................. 54
5 DESIGN GUIDELINE ........................................ 55
5.1 General design rules and requirements ............................................................................................... 55
5.2 Reference circuit .................................................................................................................................... 55
5.3 RF part design guideline ....................................................................................................................... 55
5.3.1 Early antenna design considerations ................................................................................................. 55
5.4 EMC and ESD design advice ................................................................................................................ 56
5.5 PCB Recommended land pattern ......................................................................................................... 56
5.6 Products recommended upgrade .......................................................................................................... 58
6 MANUFACTURERS ........................................... 59
6.1 Steel mesh design ................................................................................................................................... 59
6.2 Temperature curve ................................................................................................................................. 60
6.3 The Moisture Sensitivity Level (MSL) ................................................................................................. 61
6.4 Baking Requirements ............................................................................................................................ 62
7 PACKAGE STORAGE INFORMATION ............................. 63
7.1 Package information .............................................................................................................................. 63
7.1.1 Tape and reel information .............................................. 63
7.1.2 Package information .................................................... 63
7.2 Bagged storage conditions ..................................................................................................................... 64
8 SAFETY INFORMATION ...................................... 65