Specifications

L506 Hardware Design

NOTES: For product handling, storage, processing, IPC / JEDEC J-STD-020C must be

followed

6.4 Baking Requirements

Due to the humidity sensitive characteristics of the L506 module, the L506 is a vacuum packaging,

which can be stored for 6 months without damage to the package, and the ambient temperature is less

than 40 C and the relative humidity is less than 90%. To meet one of the following conditions, the

process of reflow soldering should be performed before the full bake (if trays are used, please note

whether the tray is heat-resistant.), or the module may cause permanent damage to the process.

1、Vacuum packing damage or leakage

2、The module is exposed in the air for 168 hours or more

3、The module is exposed in air for 168 hours, not meet the temperature <30 degrees and

relative humidity of the environment conditions <60%

Table6-3:Baking requirements

Baking temperature

Humidity

Baking time

120°C±5°C

<5%

4 Hours

Note: The original packaging of the module cannot bear the high temperature of baking. The

packaging needs to be removed before baking, otherwise the packaging will be damaged.