Specifications
L506 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 61
Figure 6-3 The reference temperature curve
6.3 The Moisture Sensitivity Level (MSL)
L506 module complies with the humidity level 3. At a temperature of <30 degrees and relative
humidity of <60% of the environmental conditions, dry pack to perform J-STD-020C specification
according to IPC / JEDEC standard. At a temperature of <40 degrees and a relative humidity of <90%
of the environmental conditions, in the case of unopened shelf life of at least six months. After
unpacking, Table 6-2 shows the module shelf life at different times corresponding to the level of
humidity.
Table6-2: Moisture sensitivity level and floor life
The Moisture Sensitivity Level
(MSL)
Floor Life(out of bag) at factory ambient≦+30
/60%RH
1
Unlimited at ≦+30 /85%
2
1 Year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake,it must be
reflowed within the time limit specified on the
label.
After unpacking,<30 degrees in temperature and relative humidity <60% environmental conditions,
168 hours in the SMT patch. If not meet the above conditions need to be baked.