User's Manual

EH-MC30
Ehong
®
Professional Bluetooth Solutions Provider page 3 of 17
1. Contents
1. Description ......................................................................................................................................................... 5
2. Applications ....................................................................................................................................................... 5
3. EH-MC30 Product numbering ........................................................................................................................ 5
4. Electrical Characteristics ............................................................................................................................... 5
4.1 Recommended Operation Conditions .................................................................................................................. 5
4.2 Absolute Maximum Rating .................................................................................................................................. 6
4.4 Power Consumption............................................................................................................................................. 6
5. Pinout and Terminal Description .................................................................................................................. 7
5.1 Pin Configuration ................................................................................................................................................ 7
6. Physical Interfaces ........................................................................................................................................... 8
6.1. Power Supply ............................................................................................................................................... 8
6.2. PIO ................................................................................................................................................................ 9
6.3. AIO ................................................................................................................................................................ 9
6.4. PWMs ........................................................................................................................................................... 9
6.5. UART ............................................................................................................................................................ 9
6.6. I2C Master/ Slave ...................................................................................................................................... 10
6.7. SPI Master/Slave ...................................................................................................................................... 11
6.8. SPI Debug .................................................................................................................................................. 12
7. Reference Design ........................................................................................................................................... 13
8. Layout Guidelines .......................................................................................................................................... 13
9. Mechanical and PCB Footprint Characteristics ...................................................................................... 14
10. EH-MEVK-MC30 ............................................................................................................................................... 14
10.1. EH-MEVK-MC30-PCB........................................................................................................................... 14
10.2. EH-MEVK-MC30-SCH .......................................................................................................................... 15
11. Packing .............................................................................................................................................................. 16
12. Soldering Recommendations ...................................................................................................................... 16
13. Contact Information ....................................................................................................................................... 17