User's Manual

Ehong
®
Professional Bluetooth Solutions Provider page 16 of 18
11. Packing
Figure 15： EH-MC30 Packaging（Pallet）
Remark: Packing for the pallet，one packaging quantity is 80 PCS。
12. Soldering Recommendations
EH-MC30 is compatible with industrial standard reflow profile for Pb-free solders. The reflow
profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. Consult the datasheet of
particular solder paste for profile configurations.
SMT stencil making requirements
 If bluetooth module PIN pitch ≥ 0.25mm and other component PIN pitch ≥
0.25mm ,so you choose SMT stencil thickness 1.5mm。
 If bluetooth module PIN pitch ≥ 0.25mm and other component PIN pitch ≤
0.25mm ,so you choose SMT Ladder stencil Bluetooth module thickness
1.5mm other component thickness 1.3mm .
 Solder pad open via ratio Length 1:1.2, width 1:1.