User's Manual

Bluetooth Low Energy Module
Shanghai Ehong Technologies Co., Ltd
1. Contents
1. Description ................................................................................................................................................................ 4
2. Applications .............................................................................................................................................................. 4
3. EH-MC20 Product numbering ............................................................................................................................. 4
4. Electrical Characteristics ..................................................................................................................................... 5
4.1. Recommended Operation Conditions .......................................................................................................... 5
4.2. Absolute Maximum Rating .............................................................................................................................. 5
4.3. Input/Output Terminal Characteristics .......................................................................................................... 5
4.4. Power Consumption ......................................................................................................................................... 6
5.
Pinout and Terminal Description
........................................................................................................................ 7
5.1. Pin Configuration ............................................................................................................................................... 7
6. Physical Interfaces.................................................................................................................................................. 9
6.1. Power Supply ..................................................................................................................................................... 9
6.2. PIO ........................................................................................................................................................................ 9
6.3. AIO ...................................................................................................................................................................... 10
6.4. PWM ................................................................................................................................................................... 10
6.5. UART.................................................................................................................................................................. 10
6.6. USB interface ................................................................................................................................................... 11
6.7. I2C Master ........................................................................................................................................................ 11
6.8. SPI Debug ......................................................................................................................................................... 11
7. Reference Design .................................................................................................................................................. 12
8. Layout and Soldering Considerations ........................................................................................................... 13
8.1. Soldering Recommendations ....................................................................................................................... 13
8.2. Layout Guidelines............................................................................................................................................ 13
9. Mechanical and PCB Footprint Characteristics.......................................................................................... 14
10. Packaging ............................................................................................................................................................ 15