User's Manual

©Ehong Technology Co.,Ltd 2014-2019. Page 12 of 14
8. Layout and Soldering Considerations
8.1 Soldering Recommendations
EH-MC16 is compatible with industrial standard reflow profile for Pb-free solders. The reflow
profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. Consult the datasheet of
particular solder paste for profile configurations.
Comply will give following recommendations for soldering the module to ensure reliable solder
joint and operation of the module after soldering. Since the profile used is process and layout
dependent, the optimum profile should be studied case by case. The following recommendation
should be taken as a starting point guide.
⚫ Refer to technical documentations of particular solder paste for profile configuration.
⚫ Avoid using more than one flow.
⚫ Reliability of the solder joint and self-alignment of the component are dependent on the
solder volume. Minimum of 150um stencil thickness is recommended.
⚫ Aperture size of the stencil should be 1:1 with the pad size.
⚫ A low residue, “no clean” solder paste should be used due to low mounted height of the
component.
8.2 Layout Guidelines
For optimal performance of the antenna place the module at the corner of the PCB as shown in
the figure 6. Do not place any metal (traces, components, battery etc.) within the clearance area
of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as
close to the GND pins as possible. Use good layout practices to avoid any excessive noise
coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric
material closer than 6 mm from the antenna. Any dielectric closer than 6 mm from the antenna
will detune the antenna to lower frequencies.
Figure 6： Clearance area of antenna
EH-MC16 Data Sheet